Quasi-Adiabatic Clock Networks in 3-D Voltage Stacked Systems

IF 2.8 2区 工程技术 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Andres Ayes;Eby G. Friedman
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引用次数: 0

Abstract

Power delivery in three-dimensional (3-D) integrated systems poses several challenges such as high current densities, large voltage drops due to multiple levels of resistive vertical interconnect, and significant switching noise originating from transient currents within different layers. Voltage stacking is a power delivery technique that is highly compatible with 3-D integration due to the physical proximity between layers, enabling the efficient transfer of recycled current. Power noise in clock networks is, however, not inherently addressed by 3-D voltage stacking. In this brief, a quasi-adiabatic technique between multiple clock networks within 3-D voltage stacked systems is proposed. The technique exploits the proximity of the clock networks to enable mutual charging and discharging when the clock signals transition to the same voltage. During this transition, the clock distribution networks are isolated from the power grid, reducing simultaneous switching noise and current load. The maximum current is reduced by an additional 13% as compared to only voltage stacking, the maximum voltage noise is reduced by up to 72% when the clock networks are isolated from the power grids, and the clock networks pull nearly 50% less charge from the source. The proposed technique is evaluated on a 7 nm predictive technology model.
三维电压堆叠系统中的准绝热时钟网络
三维(3-D)集成系统的电力传输面临着一些挑战,例如高电流密度,由于多层电阻垂直互连而产生的大电压降,以及不同层内瞬态电流产生的显著开关噪声。电压堆叠是一种电力传输技术,由于层与层之间的物理接近,它与3d集成高度兼容,能够有效地传输回收电流。然而,时钟网络中的功率噪声不能通过三维电压叠加来固有地解决。本文提出了三维电压堆叠系统中多个时钟网络之间的准绝热技术。该技术利用时钟网络的接近性,使时钟信号转换到相同电压时能够相互充电和放电。在此过渡期间,时钟分配网络与电网隔离,减少了同时开关噪声和电流负载。与仅电压叠加相比,最大电流减少了13%,当时钟网络与电网隔离时,最大电压噪声减少了72%,时钟网络从电源中吸收的电荷减少了近50%。在7纳米预测技术模型上对该技术进行了评估。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
6.40
自引率
7.10%
发文量
187
审稿时长
3.6 months
期刊介绍: The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels. To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.
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