Young Professionals: Report on the IEEE DEIS Fellowship

IF 2.6 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Electrical Insulation Magazine Pub Date : 2024-12-12 DOI:10.1109/MEI.2025.10794808

Praveen Sahu

引用次数: 0

Abstract

I am delighted to share my experience on the successful completion of the proposed project with the support of the DEIS Graduate Student Fellowship and my attendance at the prestigious IEEE International Power Modulator and High Voltage Conference (IPMHVC) 2024 in Indianapolis, Indiana. I also extend my deepest gratitude to my advisors, Dr. Raji Sundararajan and Dr. Ignacio Camarillo, for their unwavering support and guidance, which were instrumental in preparing for this conference.

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来源期刊

IEEE Electrical Insulation Magazine 工程技术-工程：电子与电气

CiteScore

4.60

自引率

3.40%

发文量

121

审稿时长

>12 weeks

期刊介绍： The EI Magazine publishes articles written by authors from industry, research institutes and academia. The articles are more practical in content than the papers published in the Transactions. Usually three articles are published in each issue. The articles deal with dielectric materials, processes and new developments applied to industry products. Also the EI Magazine is used to promote upcoming conferences and solicits papers for the conferences. In addition, reports on past conferences are given in many issues. Book reviews and news items are included. An editorial is written by both the EIC and the President of DEIS in alternate issues. Advertising of insulation products appears in many issues.