Multi-catalytic dye degradation using Bi7Fe3Ti3O21

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Saurabh Tiwari, Norah Salem Alsaiari, Abdelfattah Amari, Zaina Algarni, Akshay Gaur, Rahul Vaish
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引用次数: 0

Abstract

The six-layered Aurivillius compound, Bi7Fe3Ti3O21 (BFT) ceramic, is renowned for its interesting dielectric properties. With a visible range energy band gap (~ 2.20 eV) and piezoelectric characteristics, it emerges as a promising candidate for both photocatalytic and piezocatalytic applications in the degradation of organic pollutants. The current investigation explores the potential of utilizing BFT ceramic as a catalyst, investigating its performance in photocatalytic and piezocatalytic activities for the degradation of a representative pollutant named Methylene Blue (MB) dye. This research also covers tribocatalytic assessment of BFT, focusing on its performance in a catalytic process that utilizes low-frequency mechanical energy. The findings reveal that the piezocatalytic efficiency (~ 82% in 2 h) of BFT ceramic surpasses that of other catalysis processes examined in this study.

使用 Bi7Fe3Ti3O21 进行多催化染料降解
六层 Aurivillius 化合物 Bi7Fe3Ti3O21(BFT)陶瓷以其有趣的介电特性而闻名。它具有可见光范围内的能带隙(~ 2.20 eV)和压电特性,是光催化和压电催化应用于有机污染物降解的理想候选材料。目前的研究探索了利用 BFT 陶瓷作为催化剂的潜力,调查了其在降解具有代表性的污染物亚甲基蓝(MB)染料的光催化和压电催化活性方面的性能。这项研究还包括对 BFT 的摩擦催化评估,重点是其在利用低频机械能的催化过程中的性能。研究结果表明,BFT 陶瓷的压电催化效率(2 小时内约为 82%)超过了本研究中考察的其他催化过程。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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