Autonomous self-healing in a stretchable polybutadiene-based urethane and eutectic gallium indium conductive composite

IF 12.3 1区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Tran Duc Khanh, Jinho Joo, Jong-Woong Kim
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Abstract

In the burgeoning field of wearable electronics, flexible and durable conductors that can maintain consistent electrical properties under various conditions are critically needed. This research introduces a novel composite material comprising eutectic gallium-indium (EGaIn) and a polybutadiene-based urethane (PBU) specifically designed to address this challenge. EGaIn, renowned for its superior conductivity due to its liquid state at room temperature, is strategically combined with PBU, which offers inherent flexibility and remarkable self-healing capabilities derived from reversible Diels–Alder reactions. Additionally, the composite maintains exceptional electrical resistance stability, withstanding mechanical strains up to 135% without compromising performance. The material’s self-healing capability is attributed to the autonomous mending properties of EGaIn and the reversible Diels–Alder reactions in the PBU matrix. The result is an efficient restoration of the composite’s original properties upon incurring damage. Furthermore, the composite’s adaptability is showcased through its printability, allowing for precise patterning conducive to custom-designed wearable devices.

Abstract Image

可拉伸聚丁二烯基聚氨酯和共晶镓铟导电复合材料中的自主自愈功能
在蓬勃发展的可穿戴电子设备领域,迫切需要能在各种条件下保持稳定电气性能的柔性耐用导体。本研究介绍了一种新型复合材料,由共晶镓铟 (EGaIn) 和聚丁二烯基聚氨酯 (PBU) 组成,专门用于应对这一挑战。EGaIn 因其在室温下的液态而以其卓越的导电性而闻名,它与 PBU 战略性地结合在一起,PBU 具有固有的柔韧性,并通过可逆的 Diels-Alder 反应而具有显著的自愈能力。此外,这种复合材料还能保持优异的电阻稳定性,在不影响性能的情况下承受高达 135% 的机械应变。这种材料的自愈合能力归功于 EGaIn 的自主修复特性和 PBU 基体中的可逆 Diels-Alder 反应。因此,复合材料在受到损害时能有效恢复其原有性能。此外,这种复合材料的适应性还体现在它的可印刷性上,允许精确的图案设计,有利于定制设计可穿戴设备。
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来源期刊
CiteScore
17.10
自引率
4.80%
发文量
91
审稿时长
6 weeks
期刊介绍: npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.
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