A Large-Signal SPICE Model for VCSEL Based on Piece-Wise Linear RLC Elements

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Photonics Technology Letters Pub Date : 2024-11-08 DOI:10.1109/LPT.2024.3493956

Kihun Kim;Jun-Seo Kim;Jae-Young Kim;Woo-Young Choi

引用次数: 0

Abstract

We present an 850-nm VCSEL SPICE model that can be easily used for VCSEL simulation together with driver circuits. Our model consists of piece-wise linear RLC elements, whose bias-dependent parameter values are determined from measurement, and its configuration is determined with consideration for modeling and simulation convenience. The accuracy of the model is confirmed by comparing simulation results with the measurement results for the single-bit responses and the eye diagrams.

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基于片式线性 RLC 元件的 VCSEL 大信号 SPICE 模型

我们提出了一种 850 纳米 VCSEL SPICE 模型，该模型可与驱动电路一起轻松用于 VCSEL 仿真。我们的模型由片式线性 RLC 元件组成，其与偏压相关的参数值由测量结果确定，其配置的确定考虑到了建模和仿真的便利性。通过比较仿真结果与单比特响应和眼图的测量结果，证实了模型的准确性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Photonics Technology Letters 工程技术-工程：电子与电气

CiteScore

5.00

自引率

3.80%

发文量

404

审稿时长

2.0 months

期刊介绍： IEEE Photonics Technology Letters addresses all aspects of the IEEE Photonics Society Constitutional Field of Interest with emphasis on photonic/lightwave components and applications, laser physics and systems and laser/electro-optics technology. Examples of subject areas for the above areas of concentration are integrated optic and optoelectronic devices, high-power laser arrays (e.g. diode, CO2), free electron lasers, solid, state lasers, laser materials'' interactions and femtosecond laser techniques. The letters journal publishes engineering, applied physics and physics oriented papers. Emphasis is on rapid publication of timely manuscripts. A goal is to provide a focal point of quality engineering-oriented papers in the electro-optics field not found in other rapid-publication journals.