Nanoporous and IPN structural composite material of cyanate ester modified by hollow silica and polyimide

IF 4.1 2区 化学 Q2 POLYMER SCIENCE
Xiaodan Li , Rui He , Zecong Wei , Shiyun Meng , Zhenhua Fan
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Abstract

Cyanate ester resin (CE), a high-performance and low dielectric materials, was modified with amino hollow silica (HSMs-NH2) and polyimide resin (PI) to form an IPN structure. Reducing the crosslinking density of the composite system and accompanying with its steric hindrance effect, PI increased the free volume of the composite material. The hollow structure introduced by HSMs-NH2 further enhanced a low dielectric property. IPN structure and HSMs-NH2 also significantly improved the impact toughness of HSMs-NH2/PI/CE composites. The bonding between the Si–O–Si and HSMs-NH2 offered an excellent heat resistance and as well surface bonding capability to matrix, which reduced the decomposition and effectively improved their thermal stability. Simultaneously, profited by the hydrophobicity of Si–O–Si, HSMs-NH2/PI/CE composite materials enabled to keep low dielectric properties in humid environments.

Abstract Image

Abstract Image

由中空二氧化硅和聚酰亚胺改性的氰酸酯纳米多孔和 IPN 结构复合材料
氰酸酯树脂(CE)是一种高性能、低介电常数的材料,它与氨基空心二氧化硅(HSMs-NH2)和聚酰亚胺树脂(PI)共同改性,形成了一种 IPN 结构。PI 可降低复合材料体系的交联密度,并通过其立体阻碍效应增加复合材料的自由体积。HSMs-NH2 引入的中空结构进一步提高了低介电特性。IPN 结构和 HSMs-NH2 还显著提高了 HSMs-NH2/PI/CE 复合材料的冲击韧性。Si-O-Si 与 HSMs-NH2 之间的键合提供了优异的耐热性以及与基体的表面键合能力,从而减少了分解,有效提高了热稳定性。同时,由于 Si-O-Si 的疏水性,HSMs-NH2/PI/CE 复合材料能够在潮湿环境中保持较低的介电性能。
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来源期刊
Polymer
Polymer 化学-高分子科学
CiteScore
7.90
自引率
8.70%
发文量
959
审稿时长
32 days
期刊介绍: Polymer is an interdisciplinary journal dedicated to publishing innovative and significant advances in Polymer Physics, Chemistry and Technology. We welcome submissions on polymer hybrids, nanocomposites, characterisation and self-assembly. Polymer also publishes work on the technological application of polymers in energy and optoelectronics. The main scope is covered but not limited to the following core areas: Polymer Materials Nanocomposites and hybrid nanomaterials Polymer blends, films, fibres, networks and porous materials Physical Characterization Characterisation, modelling and simulation* of molecular and materials properties in bulk, solution, and thin films Polymer Engineering Advanced multiscale processing methods Polymer Synthesis, Modification and Self-assembly Including designer polymer architectures, mechanisms and kinetics, and supramolecular polymerization Technological Applications Polymers for energy generation and storage Polymer membranes for separation technology Polymers for opto- and microelectronics.
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