Wafer chamfering grinding wheels dressing via dynamic deflection laser beam

IF 3.5 2区工程技术 Q2 OPTICS

Optics and Lasers in Engineering Pub Date : 2024-11-04 DOI:10.1016/j.optlaseng.2024.108673

Hao Wang , Genyu Chen , Nengru Tao , Wei Zhou , Fengrong Luo , Dai Zhang , Jie Li

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引用次数: 0

Abstract

Wafer chamfering forming grinding wheels (WCF) is a kind of V-shaped circular groove forming wheel with a large diameter and small grooves. In this study, a dynamic deflection laser beam method is presented to improve the dressing quality of WCF. The compensation effect of deflected laser on the surface laser energy density of materials was analyzed, and the blocking effect caused by oversized deflection angle of laser beam was analyzed. A C-W model was proposed for laser dressing of WCF. Based on C-W model, trajectory planning for laser dressing was carried out, and dressing experiments were completed. The results show that the contour transition of the grinding wheel is more smooth. Compared to single direct laser beam dressing method and static deflection laser dressing method, the contour exhibits better roundness and the PV values reduced to 5.1μm. Surface observation revealed strip-shaped patterns and some flocculent metamorphic layer. The SEM result shows that there are no obvious crack defects on the surface.

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通过动态偏转激光束修整晶片倒角砂轮

晶片倒角成形砂轮（WCF）是一种直径大、沟槽小的 V 形圆槽成形砂轮。本研究提出了一种动态偏转激光束的方法来提高 WCF 的修整质量。分析了偏转激光对材料表面激光能量密度的补偿作用，并分析了激光束偏转角度过大造成的阻挡效应。提出了激光修整 WCF 的 C-W 模型。基于 C-W 模型，进行了激光修整的轨迹规划，并完成了修整实验。结果表明，砂轮的轮廓过渡更加平滑。与单束直接激光修整法和静态偏转激光修整法相比，轮廓的圆度更好，PV 值降至 5.1μm。表面观察发现了条状花纹和一些絮状变质层。扫描电镜结果表明，表面没有明显的裂纹缺陷。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Optics and Lasers in Engineering 工程技术-光学

CiteScore

8.90

自引率

8.70%

发文量

384

审稿时长

42 days

期刊介绍： Optics and Lasers in Engineering aims at providing an international forum for the interchange of information on the development of optical techniques and laser technology in engineering. Emphasis is placed on contributions targeted at the practical use of methods and devices, the development and enhancement of solutions and new theoretical concepts for experimental methods. Optics and Lasers in Engineering reflects the main areas in which optical methods are being used and developed for an engineering environment. Manuscripts should offer clear evidence of novelty and significance. Papers focusing on parameter optimization or computational issues are not suitable. Similarly, papers focussed on an application rather than the optical method fall outside the journal''s scope. The scope of the journal is defined to include the following: -Optical Metrology- Optical Methods for 3D visualization and virtual engineering- Optical Techniques for Microsystems- Imaging, Microscopy and Adaptive Optics- Computational Imaging- Laser methods in manufacturing- Integrated optical and photonic sensors- Optics and Photonics in Life Science- Hyperspectral and spectroscopic methods- Infrared and Terahertz techniques