Electrical properties of GaAsN/GaAs-superlattice films with different N distributions fabricated by atomic layer epitaxy

Abstract

The effects of nitrogen (N) distribution on the electrical properties of GaAsN films were evaluated by intentionally changing the N distribution using atomic layer epitaxy (ALE) and post-annealing. The N distribution was controlled in the growth direction by growing superlattice (SL) thin films repeatedly growing 1 GaAsN layer and 0, 3, and 5 layers of GaAs by ALE. These films were referred to as (1:0), (1:3), and (1:5), respectively. To change the N distribution in the same thin film, N atoms were diffused by post-annealing. Changes in N distribution were evaluated by X-ray diffraction as changes in GaAsN superstructure. N atoms diffused from GaAsN layers to the adjacent layers in (1:3) films annealed above 750 °C, while they remained stable in those of (1:5) films annealed at temperatures up to 850 °C. The carrier mobility of both films increased monotonically with the annealing temperature. The concentration of ionized scattering centers decreased significantly in films annealed at 650 °C (independent of their N distributions) owing to the elimination of donor-type defects by annealing. Contrarily, the concentrations of N-induced scattering centers in (1:5) films annealed below 900 °C were similar, while those in (1:3) films annealed above 750 °C decreased significantly, in agreement with the N-atom diffusion behavior of GaAsN layers. Thus, N-distribution homogenization can be related to the reduction of N-induced scattering centers.