Demonstration of Effective Intrinsic Electron Velocity >107 cm/s in Ultrawide Bandgap Al₀.₆₄Ga₀.₃₆N Channel HEMTs

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Parthasarathy Seshadri;Jiahao Chen;Kenneth Stephenson;Md Abdullah Mamun;Ruixin Bai;Zehuan Wang;Shubhra Pasayat;Asif Khan;Chirag Gupta
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引用次数: 0

Abstract

This article reports on the effective intrinsic electron velocity exceeding $10^{{7}}$ cm/s in high-composition Al $_{{0.64}}\text {Ga}_{{0.36}}$ N channel high-electron-mobility transistors (HEMTs) at peak ${f}_{t}$ . The small-signal two-port s-parameter measurements were employed at peak ${f}_{t}$ bias, which enabled us to compute the small-signal parameters and determine the total transit delay. A device with ~245-nm gate length yielded a total transit delay of 8.04 ps corresponding to a peak ${f}_{t}$ of 19.8 GHz. By segregating the delay components, the intrinsic delay was estimated to be 6.22 ps. However, this intrinsic delay includes the effect of fringe capacitances that were further decoupled to yield the intrinsic transit time. The transit time under the gate was estimated to be 2.12 ps, and thus, the peak effective intrinsic electron velocity was determined to be $1.15\times 10^{{7}}$ cm/s. These findings offer crucial insights for optimizing the design and performance of high-composition AlGaN channel HEMTs at RF power frequencies.
超宽带隙 Al₀.₆₄Ga₀.₃₆N 沟道 HEMT 中有效本征电子速度 >107 厘米/秒的证明
本文报告了在峰值 ${f}_{t}$ 时,高组成 Al $_{{0.64}}\text {Ga}_{{0.36}}$ N 沟道高电子迁移率晶体管(HEMT)中超过 $10^{{7}}$ cm/s 的有效本征电子速度。我们在峰值 ${f}_{t}$ 偏置下进行了小信号双端口 s 参数测量,从而能够计算小信号参数并确定总传输延迟。栅极长度约为 245 nm 的器件的总传输延迟为 8.04 ps,峰值 ${f}_{t}$ 为 19.8 GHz。通过分离延迟分量,本征延迟估计为 6.22 ps。然而,该固有延迟包含了边缘电容的影响,而这些电容被进一步解耦,从而得出固有传输时间。栅极下的传输时间估计为 2.12 ps,因此有效本征电子速度峰值被确定为 1.15/times 10^{{7}}$ cm/s。这些发现为优化射频功率频率下高成分 AlGaN 沟道 HEMT 的设计和性能提供了重要启示。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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