Fabrication and tribological properties of WC-reinforced Inconel X-750 alloy at elevated temperature

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
Gongbin Tang , Shulong Sun , Jinfeng Yang , Yiting Pan , Zhicheng Liu , Zhongwei Liang
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引用次数: 0

Abstract

The nickel-based superalloy Inconel X-750, valued for its exceptional mechanical properties, is used in gas-lubricated foil bearings. However, prolonged exposure to high temperatures can lead to wear failure, affecting their service life. Here, we propose a novel method named ultrasonic strengthening grinding (USG) that applies a WC coating on Inconel X-750. Friction tests reveal that at 600 °C, the friction coefficient and wear rate of the USG-treated samples were reduced by 30.2 % and 79.7 %, respectively. Detailed experiments and analysis demonstrate that the surface grain refinement and the WC-rich coating cooperate to improve the high-temperature tribological properties. These findings offer new insights into the design of wear-resistant coatings for enhancing the high-temperature tribological performance of Inconel X-750 Alloy.
高温下 WC 增强 Inconel X-750 合金的制造和摩擦学特性
镍基超合金 Inconel X-750 因其卓越的机械性能而备受推崇,被用于气体润滑箔轴承。然而,长期暴露在高温下会导致磨损失效,影响其使用寿命。在此,我们提出了一种名为 "超声波强化研磨(USG)"的新方法,在 Inconel X-750 上涂覆一层 WC 涂层。摩擦测试表明,在 600 °C 下,经过 USG 处理的样品的摩擦系数和磨损率分别降低了 30.2% 和 79.7%。详细的实验和分析表明,表面晶粒细化和富含 WC 的涂层共同改善了高温摩擦学特性。这些发现为提高 Inconel X-750 合金高温摩擦学性能的耐磨涂层设计提供了新的思路。
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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