Short-term tensile creep behavior of CoCrNi-based multi-principal element alloys

IF 4.3 2区材料科学 Q2 CHEMISTRY, PHYSICAL

Intermetallics Pub Date : 2024-09-22 DOI:10.1016/j.intermet.2024.108500

Kaiju Lu, Jarir Aktaa

引用次数: 0

Abstract

We report the short-term tensile creep behavior of CoCrFeMnNi and CoCrNi model MPEAs at 550 °C. Dislocation glide and dislocation-dislocation/lattice interactions are proposed to be dominated deformation mechanisms for CoCrFeMnNi and CoCrNi, respectively. Besides, compared to CoCrFeMnNi, CoCrNi exhibits lower creep rate and longer rupture time at same testing conditions. This is attributed to CoCrNi's lower stacking fault energy and higher lattice friction. Additionally, the effect of grain size on the short-term creep behavior of CoCrFeMnNi was revealed.

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钴铬镍基多主元素合金的短期拉伸蠕变行为

我们报告了 CoCrFeMnNi 和 CoCrNi 模型 MPEA 在 550 ℃ 下的短期拉伸蠕变行为。我们认为位错滑行和位错-位错/晶格相互作用分别是 CoCrFeMnNi 和 CoCrNi 的主要变形机制。此外，与 CoCrFeMnNi 相比，CoCrNi 在相同测试条件下的蠕变率更低，断裂时间更长。这归因于 CoCrNi 较低的堆积断层能和较高的晶格摩擦力。此外，研究还揭示了晶粒大小对 CoCrFeMnNi 短期蠕变行为的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Intermetallics 工程技术-材料科学：综合

CiteScore

7.80

自引率

9.10%

发文量

291

审稿时长

37 days

期刊介绍： This journal is a platform for publishing innovative research and overviews for advancing our understanding of the structure, property, and functionality of complex metallic alloys, including intermetallics, metallic glasses, and high entropy alloys. The journal reports the science and engineering of metallic materials in the following aspects: Theories and experiments which address the relationship between property and structure in all length scales. Physical modeling and numerical simulations which provide a comprehensive understanding of experimental observations. Stimulated methodologies to characterize the structure and chemistry of materials that correlate the properties. Technological applications resulting from the understanding of property-structure relationship in materials. Novel and cutting-edge results warranting rapid communication. The journal also publishes special issues on selected topics and overviews by invitation only.