Understanding the compaction behavior of uncured thermoset prepreg: Experimental investigation and theoretical analyses

IF 4.8 2区 材料科学 Q2 MATERIALS SCIENCE, COMPOSITES
Lei Yan, Bowen Gong, Shuyi Wang, Baofa Cheng, Cheng Sun, Wenting Ouyang, Huan Wang, Hua‐Xin Peng
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引用次数: 0

Abstract

The deformation behavior of uncured thermoset prepreg during hot compaction process was investigated by dividing the whole compaction process into an initial compression stage and the subsequent creep stage. At the compression stage, there existed a strain‐softening phenomenon in the temperature range of 50–90°C, indicating different deformation behavior that is mainly determined by the viscosity of prepreg. Following an appraisal of advantages and limitations of existing compaction models, a combination model consisted of a modified power‐law model including the influence of temperature and the generalized Kelvin‐Voigt model was proposed to describe the deformation behavior of prepreg during compression and creep stage, respectively. Finally, a discussion on the compaction mechanism was conducted to offer some insights into the deformation process.Highlights Strain‐softening phenomenon occurred during the compaction of uncured prepreg. Proposed combination model captures the deformation of uncured prepreg well. The percolation mechanism dominates prepreg deformation during compaction. The squeeze flow mechanism causes limited thickness reduction of prepreg.

Abstract Image

了解未固化热固性预浸料的压实行为:实验研究和理论分析
通过将整个压实过程分为初始压缩阶段和随后的蠕变阶段,研究了未固化热固性预浸料在热压实过程中的变形行为。在压缩阶段,50-90°C 温度范围内存在应变软化现象,表明不同的变形行为主要由预浸料的粘度决定。在对现有压实模型的优点和局限性进行评估后,提出了一个由包含温度影响的修正幂律模型和广义开尔文-伏依格特模型组成的组合模型,以分别描述预浸料在压缩和蠕变阶段的变形行为。最后,对压实机理进行了讨论,为变形过程提供了一些启示。提出的组合模型很好地捕捉了未固化预浸料的变形。在压实过程中,渗流机制主导了预浸料的变形。挤压流动机理导致预浸料厚度的有限减薄。
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来源期刊
Polymer Composites
Polymer Composites 工程技术-材料科学:复合
CiteScore
7.50
自引率
32.70%
发文量
673
审稿时长
3.1 months
期刊介绍: Polymer Composites is the engineering and scientific journal serving the fields of reinforced plastics and polymer composites including research, production, processing, and applications. PC brings you the details of developments in this rapidly expanding area of technology long before they are commercial realities.
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