A machine learning approach to accelerate reliability prediction in nanowire FETs from self-heating perspective

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
T. Sandeep Kumar , Anusha Hazarika , P.S.T.N. Srinivas , Pramod Kumar Tiwari , Arun Kumar
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引用次数: 0

Abstract

Nanowire Field Effect Transistors (NWFETs) have been considered as the next-generation technology for sub-10 nm technology nodes, succeeding FinFETs. However, the highly confined nature of Nanowire FETs creates reliability issues that significantly impact their performance. Therefore, this work proposes a machine learning-based technique for analyzing the self-heating-induced reliability issues in NWFETs. The influence of self-heating effects in NWFET has been predicted in terms of saturation current (Idsat), threshold voltage (Vth), the maximum carrier temperature along the channel (eTmax), and the maximum Lattice temperature (LTmax) with multivariable regression. TCAD-assisted machine learning has been used for algorithm training and prediction. A dataset has been created by varying the parameters of the NWFETs like the thickness of the channel (tsi), the thickness of oxide (tox), Length of source/drain (Lsd), length of source/drain contact (Lsdc), doping concentrations etc. The Random Forest Regression algorithm has been used to estimate the performance of NWFETs in predicting the desired output parameters suitably with the given dataset.

从自加热角度加速纳米线场效应晶体管可靠性预测的机器学习方法
纳米线场效应晶体管(NWFET)被认为是继 FinFET 之后,适用于 10 纳米以下技术节点的下一代技术。然而,纳米线场效应晶体管的高度封闭性造成了可靠性问题,严重影响了其性能。因此,本研究提出了一种基于机器学习的技术,用于分析纳米线场效应晶体管中自加热引起的可靠性问题。通过多变量回归,从饱和电流 (Idsat)、阈值电压 (Vth)、沟道最大载流子温度 (eTmax) 和最大晶格温度 (LTmax) 等方面预测了 NWFET 中自加热效应的影响。TCAD 辅助机器学习被用于算法训练和预测。通过改变 NWFET 的参数,如沟道厚度 (tsi)、氧化物厚度 (tox)、源极/漏极长度 (Lsd)、源极/漏极接触长度 (Lsdc)、掺杂浓度等,创建了一个数据集。随机森林回归算法用于估算 NWFET 的性能,根据给定的数据集预测所需的输出参数。
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来源期刊
Microelectronics Reliability
Microelectronics Reliability 工程技术-工程:电子与电气
CiteScore
3.30
自引率
12.50%
发文量
342
审稿时长
68 days
期刊介绍: Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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