Effect of individual and synergistic alloying of In and Ni on microstructure, phase stability and thermal properties of lead-free Sn-0.7Cu solder

IF 1.5 4区材料科学 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY

Philosophical Magazine Pub Date : 2024-07-29 DOI:10.1080/14786435.2024.2383771

Ayushi Thakur, Jayant Jain, Sangeeta Santra

引用次数: 0

Abstract

The study explores the individual and synergistic effect of alloying indium (In) and nickel (Ni) with Sn-0.7 wt.% Cu solder on microstructure and thermal properties. Solders consist of β-Sn phase m...

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铟和镍的单独和协同合金化对无铅锡-0.7 铜焊料微观结构、相稳定性和热性能的影响

该研究探讨了铟和镍与锡-0.7 wt.%铜焊料合金化对微观结构和热性能的单独和协同效应。焊料是由β-Sn相的铟和镍组成。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Philosophical Magazine 工程技术-材料科学：综合

自引率

0.00%

发文量

审稿时长

4.7 months

期刊介绍： The Editors of Philosophical Magazine consider for publication contributions describing original experimental and theoretical results, computational simulations and concepts relating to the structure and properties of condensed matter. The submission of papers on novel measurements, phases, phenomena, and new types of material is encouraged.