{"title":"Electromagnetic Coupling Estimation Based on Hybrid Equivalent Dipoles and Field-Circuit Models","authors":"Yu Tian;Qi-Han Xiao;Xing-Chang Wei;Si-Yao Tang;Tian-Hao Song;Richard Xian-Ke Gao","doi":"10.1109/TEMC.2024.3431914","DOIUrl":null,"url":null,"abstract":"In most practical electromagnetic interference (EMI) problems, the intricate nature of both EMI source and victim structure often renders direct modeling unfeasible. To address this challenge, this article introduces an innovative EMI estimation method based on hybrid equivalent models. This approach involves the extraction of equivalent dipoles model for EMI source and equivalent circuit model for victim device. To establish the equivalent dipole model for the EMI source, near-field scanning is employed to obtain the phaseless near-field. Subsequently, the dynamic differential evolution method is utilized to derive the equivalent dipole model based on the acquired near-field amplitudes. For the victim's device, a specialized fixture is designed and the de-embedding method is applied to obtain the equivalent \n<italic>S</i>\n-parameter model. Incorporating the two equivalent models into a hybrid field-circuit simulation enables an effective estimation of EMI coupling between the EMI source and victim. The efficacy of the proposed method is substantiated through rigorous validation exercises involving numerical simulations and physical measurements, including various EMI sources and victim devices.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 5","pages":"1577-1584"},"PeriodicalIF":2.0000,"publicationDate":"2024-08-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electromagnetic Compatibility","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10623309/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In most practical electromagnetic interference (EMI) problems, the intricate nature of both EMI source and victim structure often renders direct modeling unfeasible. To address this challenge, this article introduces an innovative EMI estimation method based on hybrid equivalent models. This approach involves the extraction of equivalent dipoles model for EMI source and equivalent circuit model for victim device. To establish the equivalent dipole model for the EMI source, near-field scanning is employed to obtain the phaseless near-field. Subsequently, the dynamic differential evolution method is utilized to derive the equivalent dipole model based on the acquired near-field amplitudes. For the victim's device, a specialized fixture is designed and the de-embedding method is applied to obtain the equivalent
S
-parameter model. Incorporating the two equivalent models into a hybrid field-circuit simulation enables an effective estimation of EMI coupling between the EMI source and victim. The efficacy of the proposed method is substantiated through rigorous validation exercises involving numerical simulations and physical measurements, including various EMI sources and victim devices.
期刊介绍:
IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.