Comparison of Semiconductor Reverse Osmosis System Performance With Conventional and 3D Printed Feed Channels

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Semiconductor Manufacturing Pub Date : 2024-07-26 DOI:10.1109/tsm.2024.3430820

Christopher Kurth, Zhewei Zhang, Kevin Roderick, Jay Kendall Weingardt, Richard Lopez, Hwee Kiang, Peter Navaneethakrishnan, Deena Starkel

引用次数: 0

查看原文本刊更多论文

使用传统和 3D 打印进料通道的半导体反渗透系统性能比较

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

IEEE Transactions on Semiconductor Manufacturing 工程技术-工程：电子与电气

CiteScore

5.20

自引率

11.10%

发文量

101

审稿时长

3.3 months

期刊介绍： The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.