Correction: Impact of Co on Thermal Aging in Sn58Bi/Cu Solder Joints: IMC Growth and Transformation in Mechanical Properties

IF 3.3 3区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Metals and Materials International Pub Date : 2024-07-13 DOI:10.1007/s12540-024-01747-0

Xi Huang, Liang Zhang, Li-bin Rao, Lei Sun

引用次数: 0

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更正：钴对 Sn58Bi/Cu 焊点热老化的影响：IMC 生长和机械性能变化

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Metals and Materials International 工程技术-材料科学：综合

CiteScore

7.10

自引率

8.60%

发文量

197

审稿时长

3.7 months

期刊介绍： Metals and Materials International publishes original papers and occasional critical reviews on all aspects of research and technology in materials engineering: physical metallurgy, materials science, and processing of metals and other materials. Emphasis is placed on those aspects of the science of materials that are concerned with the relationships among the processing, structure and properties (mechanical, chemical, electrical, electrochemical, magnetic and optical) of materials. Aspects of processing include the melting, casting, and fabrication with the thermodynamics, kinetics and modeling.