Preparation and Evaluation of Epoxy Based Material for High Performance Electronic Packaging through the Surface Modification of Fillers

IF 1.2 4区工程技术 Q4 POLYMER SCIENCE

Journal of Macromolecular Science Part B-Physics Pub Date : 2024-06-30 DOI:10.1080/00222348.2024.2372970

Rongjun Yi, Jiexi Ke, Jianwen Zhou, Hong Wang

引用次数: 0

Abstract

The continuous integration and refinement of electronic equipment results in the more stringent requirements for epoxy resin (EP) based materials, such as excellent heat dissipation and low coeffic...

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通过填料表面改性制备和评估用于高性能电子封装的环氧基材料

随着电子设备的不断集成和改进，对基于环氧树脂 (EP) 的材料提出了更严格的要求，如优异的散热性和低系数。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Macromolecular Science Part B-Physics 工程技术-高分子科学

CiteScore

2.50

自引率

21.40%

发文量

审稿时长

2.3 months

期刊介绍： Devoted to the publication of significant fundamental contributions to the physics of macromolecular solids and liquids, both synthetic and natural, this international journal publishes original research in all of the areas generally included in both polymer solid state and liquid physics. This authoritative journal contains papers reporting research in transition mechanisms and structure-property relationships, the physics of polymer solutions and melts, of glassy and rubbery amorphous solids, and the physics of individual polymer molecules.