Numerical investigation of printed circuit board response during solder float test: Influence of thermal boundary conditions

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2024-06-20 DOI:10.1016/j.microrel.2024.115441

Paul Perin, Gautier Girard, Marion Martiny, Sébastien Mercier

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Abstract

During qualification, a Printed Circuit Board (PCB) must pass several electrical and thermomechanical tests. Among the tests required by the European Cooperation for Space Standardization (ECSS), the solder float test consists in resting a sample on a 288 °C solder bath. In order to simulate and better understand the latter, the heat transfer coefficient (HTC) of the PCB/solder bath interface has to be characterized.

In this work, an experimental setup has been developed to measure the HTC of the interface between SnPb and a horizontal surface. In addition, a finite element model of the solder float test has been developed in order to study the temperature and stress fields inside the PCB. The temperature field is highly heterogeneous at the beginning of the heating. A direct consequence of this early temperature heterogeneity is the development of stress fields that can be correlated to the observed failure modes. A parametric study revealed the sensitivity of the stress and strain development to changes in the HTC value. The difference observed in finite element simulations between isothermal assumptions and transient regime holds true for any maximum temperature in the range of 100 °C to 288 °C. The present work highlights the importance of considering exact thermal boundary conditions when studying the reliability of PCBs under thermal loading (especially with fast changes).

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浮焊测试期间印刷电路板响应的数值研究：热边界条件的影响

在鉴定过程中，印刷电路板（PCB）必须通过多项电气和热机械测试。在欧洲空间标准化合作组织（ECSS）要求的测试中，浮焊测试包括将样品放置在 288 °C 的焊锡槽中。为了模拟和更好地理解后者，必须对印刷电路板/焊槽界面的传热系数（HTC）进行表征。在这项工作中，开发了一种实验装置，用于测量锡铅和水平表面之间界面的 HTC。此外，为了研究印刷电路板内部的温度场和应力场，还开发了一个浮焊测试的有限元模型。在加热开始时，温度场高度异构。这种早期温度异质性的直接后果是应力场的发展，而应力场可与观察到的失效模式相关联。参数研究揭示了应力和应变发展对 HTC 值变化的敏感性。在有限元模拟中观察到的等温假设与瞬态机制之间的差异，对于 100 °C 至 288 °C 范围内的任何最高温度都是适用的。本研究强调了在研究热负荷（尤其是快速变化时）下印刷电路板可靠性时考虑精确热边界条件的重要性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.