Dhanasekar R, Ganesh Kumar Srinivasan, Marco Rivera
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引用次数: 0
Abstract
Purpose
The purpose of this study is to stabilize the rotating speed of the permanent magnet direct current (PMDC) motor driven by a DC-DC boost converter under mismatched disturbances (i.e.) under varying load circumstances like constant, frictional, fan type, propeller and undefined torques.
Design/methodology/approach
This manuscript proposes a higher order sliding mode control to elevate the dynamic behavior of the speed controller and the robustness of the PMDC motor. A second order classical sliding surface and proportional-integral-derivative sliding surface (PIDSS) are designed and compared.
Findings
For the boost converter with PMDC motor, both simulation and experimentation are exploited. The prototype is built for an 18 W PMDC motor with field programmable gate arrays. The suggested sliding mode with second order improves the robustness of the arrangement under disturbances with a wide range of control. Both the simulation and experimental setup shows satisfactory results.
Originality/value
According to software-generated mathematical design and experimental findings, PIDSS exhibits excellent performance with respect to settling speed, steady-state error and peak overshoot.
期刊介绍:
Circuit World is a platform for state of the art, technical papers and editorials in the areas of electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety. The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics. Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes.
Circuit World covers a broad range of topics, including:
• Circuit theory, design methodology, analysis and simulation
• Digital, analog, microwave and optoelectronic integrated circuits
• Semiconductors, passives, connectors and sensors
• Electronic packaging of components, assemblies and products
• PCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes)
• Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal)
• Internet of Things (IoT).