Cyanate ester and polyethylene glycol based high temperature resistant shape memory polymer development for space applications

IF 4.5 3区 工程技术 Q1 CHEMISTRY, APPLIED
Sandaruwan Jayalath , Madhubhashitha Herath , Jayantha Epaarachchi , Eduardo Trifoni , Eleftherios E. Gdoutos , Bandu Samarasekara
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引用次数: 0

Abstract

Cyanate Ester (CE)/Polyethylene glycol (PEG) based shape memory polymers (SMPs) offer a sustainable solution for space applications due to their high glass transition temperature and durability. PEG is a type of oligomer used as a shape memory effect modifier for CE. Due to the low toughness of CE-based polymers, they are often modified with epoxies to increase their toughness. However, the high molecular chain length of PEGs can also act as a plasticiser increasing the toughness of the CE/PEG-based SMPs instead of epoxies. This study explores the synergistic use of PEG with CE to optimise SMPs with comparable mechanical and shape memory properties, along with tailorable glass transition temperatures. During the synthesis, PEG 600, 1000, 2000 & 4000 were individually combined with CE monomers in varying stoichiometric ratios to produce a set of SMP specimens. Thermo-mechanical properties, and shape memory properties were experimentally obtained and graded as a function of different molecular weights of PEGs and their stoichiometric ratios. CE SMPs modified with PEG600 and 1000 exhibited stable storage moduli and therefore selected for further investigation. A single-parameter empirical model was developed to correlate Tg with stoichiometric ratios, enabling the prediction of Tg values for different CE: PEG600/1000 ratios or vice versa. The tensile and flexural properties at elevated temperatures were also studied. Notably, the use of lower molecular weight PEGs mitigated the storage modulus drops, while higher molecular weight PEGs significantly improved the toughness. Moreover, synthesised SMPs in the Tg range of 125–130 °C using PEG600 and PEG1000 showed improved stability of storage modulus. The SMP with PEG600 showed better thermo-mechanical properties, storage modulus stability at higher temperatures, and shape memory behaviour compared to the SMP with PEG1000. This research contributes to developing robust and adaptable SMPs for space environments, bridging the gap between mechanical performance and shape memory capabilities.

Abstract Image

为太空应用开发基于氰酸酯和聚乙二醇的耐高温形状记忆聚合物
基于氰酸酯(CE)/聚乙二醇(PEG)的形状记忆聚合物(SMP)具有较高的玻璃化转变温度和耐久性,可为太空应用提供可持续的解决方案。PEG 是一种低聚物,用作 CE 的形状记忆效应改性剂。由于 CE 类聚合物的韧性较低,因此通常使用环氧树脂对其进行改性,以提高其韧性。然而,PEG 的高分子链长也可作为增塑剂,代替环氧树脂增加 CE/PEG 基 SMP 的韧性。本研究探讨了 PEG 与 CE 的协同作用,以优化具有可比机械和形状记忆特性以及可定制玻璃化转变温度的 SMP。在合成过程中,PEG 600、1000、2000 & 4000 分别与 CE 单体以不同的化学计量比结合,生成一组 SMP 试样。通过实验获得了热机械性能和形状记忆性能,并根据 PEG 的不同分子量及其化学计量比进行了分级。用 PEG600 和 1000 改性的 CE SMP 具有稳定的存储模量,因此被选作进一步研究的对象。我们建立了一个单参数经验模型,将 Tg 与化学计量比联系起来,从而能够预测不同 CE.PEG600/1000 比率的 Tg 值:PEG600/1000 比率的 Tg 值,反之亦然。此外,还研究了高温下的拉伸和弯曲性能。值得注意的是,使用较低分子量的 PEG 可减轻存储模量的下降,而较高分子量的 PEG 则可显著提高韧性。此外,在 125-130 °C 的 Tg 范围内,使用 PEG600 和 PEG1000 合成的 SMP 显示出更高的贮存模量稳定性。与使用 PEG1000 的 SMP 相比,使用 PEG600 的 SMP 具有更好的热机械性能、更高温度下的存储模量稳定性以及形状记忆行为。这项研究有助于开发适用于太空环境的坚固耐用的 SMP,缩小机械性能与形状记忆能力之间的差距。
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来源期刊
Reactive & Functional Polymers
Reactive & Functional Polymers 工程技术-高分子科学
CiteScore
8.90
自引率
5.90%
发文量
259
审稿时长
27 days
期刊介绍: Reactive & Functional Polymers provides a forum to disseminate original ideas, concepts and developments in the science and technology of polymers with functional groups, which impart specific chemical reactivity or physical, chemical, structural, biological, and pharmacological functionality. The scope covers organic polymers, acting for instance as reagents, catalysts, templates, ion-exchangers, selective sorbents, chelating or antimicrobial agents, drug carriers, sensors, membranes, and hydrogels. This also includes reactive cross-linkable prepolymers and high-performance thermosetting polymers, natural or degradable polymers, conducting polymers, and porous polymers. Original research articles must contain thorough molecular and material characterization data on synthesis of the above polymers in combination with their applications. Applications include but are not limited to catalysis, water or effluent treatment, separations and recovery, electronics and information storage, energy conversion, encapsulation, or adhesion.
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