Direct Deposition of Carbon Films on Tungsten Substrates Using Coaxial Arc Plasma Deposition for Electrochemical Electrode Applications

IF 1 4区工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEJ Transactions on Electrical and Electronic Engineering Pub Date : 2024-05-26 DOI:10.1002/tee.24118

Takeshi Hara, Hiroaki Moriya, Masumi Ogishima, Satoki Nagano, Tsuyoshi Yoshitake

引用次数: 0

Abstract

Carbon films were directly formed on tungsten (W) substrates without an intermediate layer via coaxial arc plasma deposition. The substrate surface was pretreated to remove the native oxide films to improve film adhesion using environmentally friendly alkaline and acidic solutions. The fundamental electrochemical characteristics of the deposited films were similar to those of diamond and diamond-like carbon films. Thus, the deposited films can be used in the electrodes of highly sensitive electrochemical sensors. © 2024 Institute of Electrical Engineers of Japan and Wiley Periodicals LLC.

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利用同轴电弧等离子体沉积技术在钨基板上直接沉积碳薄膜以实现电化学电极应用

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来源期刊

IEEJ Transactions on Electrical and Electronic Engineering 工程技术-工程：电子与电气

CiteScore

2.70

自引率

10.00%

发文量

199

审稿时长

4.3 months

期刊介绍： IEEJ Transactions on Electrical and Electronic Engineering (hereinafter called TEEE ) publishes 6 times per year as an official journal of the Institute of Electrical Engineers of Japan (hereinafter "IEEJ"). This peer-reviewed journal contains original research papers and review articles on the most important and latest technological advances in core areas of Electrical and Electronic Engineering and in related disciplines. The journal also publishes short communications reporting on the results of the latest research activities TEEE ) aims to provide a new forum for IEEJ members in Japan as well as fellow researchers in Electrical and Electronic Engineering from around the world to exchange ideas and research findings.