A “Smart” Gas Sensing System Composed of Micro-Hotplates and Artificial Neural Network

IF 2.5 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Microelectromechanical Systems Pub Date : 2023-12-28 DOI:10.1109/JMEMS.2023.3343815

Zong Liu;Yushen Hu;Fei Wang;Man Wong

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引用次数: 0

Abstract

Integrating in one package a gas sensor array (GSA) unit and an artificial neural network (ANN) unit, a gas-sensing system based on two types of metal-oxide semiconductors is described. The GSA consists of micro-hotplates (MHPs) monolithically integrated with thin-film transistors (TFTs) built using a first metal-oxide semiconductor (MOS). The structural plates for realizing the MHPs are spontaneously suspended over a sealed cavity without requiring a sacrificial layer etch, thus largely overcoming potential issues of process incompatibility between the construction of the MHPs and the TFT active-matrix circuits. A second gas-sensing MOS is coated on the MHPs to reduce process complexity, with the resulting low sensing specificity remedied by exploiting the different temperature-dependent sensitivities of the different gas species. ANN consisting of dual-gate TFTs has been fabricated and trained for inferencing gas identification and quantification. This technology can be more generally applied to realizing other micro-fabricated “smart” sensors. [2023-0159]

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由微型加热板和人工神经网络组成的 "智能 "气体传感系统

本文介绍了一种基于两种金属氧化物半导体的气体传感系统，它将气体传感器阵列（GSA）单元和人工神经网络（ANN）单元集成在一个封装中。气体传感器阵列由微型热板（MHP）和使用第一种金属氧化物半导体（MOS）制造的薄膜晶体管（TFT）单片集成而成。用于实现 MHP 的结构板自发悬浮在密封腔体上，无需牺牲层蚀刻，从而在很大程度上克服了 MHP 结构与 TFT 有源矩阵电路之间潜在的工艺不兼容问题。在 MHP 上镀有第二层气体感应 MOS，以降低工艺复杂性，并利用不同气体种类对温度的不同敏感性，解决了由此造成的感应特异性低的问题。由双栅极 TFT 组成的 ANN 已经制作完成并经过训练，可用于推断气体的识别和定量。这项技术可更广泛地应用于实现其他微加工 "智能 "传感器。[2023-0159]

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Microelectromechanical Systems 工程技术-工程：电子与电气

CiteScore

6.20

自引率

7.40%

发文量

115

审稿时长

7.5 months

期刊介绍： The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.