Experimental approach for measuring the peeling strength of a sheet bonded on a curved adherend with pressure sensitive adhesive and predicting the peeling resistance by finite element analysis

Akihiro Maesaka, Yushin Kakei, Tsutomu Osaka, Yoshihiro Kudo, Yu Sekiguchi, Chiaki Sato
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Abstract

To evaluate the peel resistance of a device wherein a polyimide (PI) sheet is bonded to a curved surface with a pressure-sensitive adhesive (PSA) experimentally and analytically, we applied a mecha...
测量用压敏胶粘合在曲面粘合剂上的薄片的剥离强度并通过有限元分析预测剥离阻力的实验方法
为了通过实验和分析评估聚酰亚胺(PI)薄片与压敏粘合剂(PSA)粘合在曲面上的装置的抗剥离性,我们采用了一种机械方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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