DEVELOPMENT of Cu MATRIX COMPOSITE CONTACTORS REINFORCED by NICKEL COATED SiC

Abstract

In this study, Cu-Ni coated SiC composite samples were produced by electric current assisted sintering (ECAS) method by adding electroless nickel coated SiC powders to copper powders produced by cementation method at the ratios of 0.5, 1 and 1.5 wt%. The relative densities of the produced samples were measured by Archimedes’ principle, their microstructures were examined by SEM-EDS, dominant phases were determined by XRD technique; microhardness and electrical conductivity measurements were made. The relative density of undoped copper was determined as 99.42% and the relative density value of Cu-Ni SiC composite samples decreased to 98.35% at most with increasing SiC ratio. The hardness values of Cu-Ni SiC composite samples increased from 120HV to 145HV with the addition of SiC; electrical conductivity values decreased from 90.41 IACS (International annealed copper standard) to 58.56 IACS.