Structural Analysis and Service Life Prediction of Rubberized Thin Surfacing Hot Mix Asphalt

IF 0.9 Q3 ENGINEERING, MULTIDISCIPLINARY
S. K. Nugroho, Ary Setyawan, Arif Budiarto
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引用次数: 0

Abstract

Rubberized thin surfacing hot mix asphalt (RTSHMA) is a type of flexible pavement that is currently being developed. It can provide the same good performance as asphalt concrete–wearing course (AC-WC). Based on previous research, the use of crumb rubber in the asphalt mixture can provide several advantages, such as increasing the flexibility of the mix so that the pavement is more resistant to cracking. Based on research showing the advantages of rubberized asphalt, the idea emerged to apply it in the field, namely on the Palur–Sragen City Boundary section as wearing course. The method of analysis in this study was modeling the pavement structure with the KENPAVE and BISAR 3.0 programs. The analysis results showed that the AC-WC model and RTSHMA model have the same good performance because both of them have a service life of more than twenty years, which is the standard for flexible pavements. However, RTSHMA has an advantage, i.e., the thickness layer is 25% thinner than AC-WC’s. With a thinner layer than AC-WC but the same good performance, RTSHMA is worth considering as an alternative pavement, especially for overlays.
橡胶薄层热拌沥青的结构分析和使用寿命预测
橡胶薄层热拌沥青(RTSHMA)是目前正在开发的一种柔性路面。它能提供与沥青混凝土耐磨层(AC-WC)相同的良好性能。根据以往的研究,在沥青混合料中使用橡胶屑可带来多种优势,如增加混合料的柔韧性,使路面更不易开裂。研究显示了橡胶沥青的优势,因此产生了将其应用于实地的想法,即在帕鲁尔-斯拉根城市边界路段使用橡胶沥青作为磨耗层。本研究的分析方法是使用 KENPAVE 和 BISAR 3.0 程序对路面结构进行建模。分析结果表明,AC-WC 模型和 RTSHMA 模型具有相同的良好性能,因为它们的使用寿命都超过了 20 年,这是柔性路面的标准。不过,RTSHMA 有一个优势,即厚度层比 AC-WC 薄 25%。RTSHMA 路层比 AC-WC 路层薄,但性能同样良好,值得考虑作为一种替代路面,特别是用于加铺路面。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of Engineering and Technological Sciences
Journal of Engineering and Technological Sciences ENGINEERING, MULTIDISCIPLINARY-
CiteScore
2.30
自引率
11.10%
发文量
77
审稿时长
24 weeks
期刊介绍: Journal of Engineering and Technological Sciences welcomes full research articles in the area of Engineering Sciences from the following subject areas: Aerospace Engineering, Biotechnology, Chemical Engineering, Civil Engineering, Electrical Engineering, Engineering Physics, Environmental Engineering, Industrial Engineering, Information Engineering, Mechanical Engineering, Material Science and Engineering, Manufacturing Processes, Microelectronics, Mining Engineering, Petroleum Engineering, and other application of physical, biological, chemical and mathematical sciences in engineering. Authors are invited to submit articles that have not been published previously and are not under consideration elsewhere.
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