{"title":"Investigation and Modelling of Copper Electroforming Process for Surface Roughness Parameters Using Regression and Pareto ANOVA Analyses","authors":"Amir Masoud Behagh, Alireza Fadaei Tehrani","doi":"10.3103/s1068375523060066","DOIUrl":null,"url":null,"abstract":"<h3 data-test=\"abstract-sub-heading\">Abstract</h3><p>The objective of this paper was to examine the effect of such deposited copper electroforming process control parameters as the applied voltage, the process time, the filler content, and the copper sulfate concentration on the surface roughness. For this purpose, an electroforming setup was made using a copper sulfate electroforming bath. A full factorial method was used to design the experiments with four control factors, each of them of two levels. After conducting each experiment, the prepared copper electroformed samples were characterized using a contact profilemeter and measuring certain surface roughness parameters, namely, the average roughness, the root mean square roughness, the average maximum height of the profile, and the autocorrelation length. Finally, the regression modelling was used to obtain a predictive model based on the measurements data. Also, the Pareto ANOVA analysis was performed for each surface roughness parameter to evaluate the contribution ratio of the control factors. The results demonstrated that a different control factor is dominant for each surface roughness parameter.</p>","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":null,"pages":null},"PeriodicalIF":0.9000,"publicationDate":"2023-12-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Surface Engineering and Applied Electrochemistry","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.3103/s1068375523060066","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 0
Abstract
The objective of this paper was to examine the effect of such deposited copper electroforming process control parameters as the applied voltage, the process time, the filler content, and the copper sulfate concentration on the surface roughness. For this purpose, an electroforming setup was made using a copper sulfate electroforming bath. A full factorial method was used to design the experiments with four control factors, each of them of two levels. After conducting each experiment, the prepared copper electroformed samples were characterized using a contact profilemeter and measuring certain surface roughness parameters, namely, the average roughness, the root mean square roughness, the average maximum height of the profile, and the autocorrelation length. Finally, the regression modelling was used to obtain a predictive model based on the measurements data. Also, the Pareto ANOVA analysis was performed for each surface roughness parameter to evaluate the contribution ratio of the control factors. The results demonstrated that a different control factor is dominant for each surface roughness parameter.
期刊介绍：
Surface Engineering and Applied Electrochemistry is a journal that publishes original and review articles on theory and applications of electroerosion and electrochemical methods for the treatment of materials; physical and chemical methods for the preparation of macro-, micro-, and nanomaterials and their properties; electrical processes in engineering, chemistry, and methods for the processing of biological products and food; and application electromagnetic fields in biological systems.
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