Special Issue on the 2023 International Symposium on Networks-on-Chip (NOCS 2023)

IF 1.9 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Mahdi Nikdast, Miquel Moreto, Masoumeh Azin Ebrahimi, Sujay Deb
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引用次数: 0

Abstract

The International Symposium on networks-on-chip (NOCS) serves as the premier interdisciplinary meeting for research on NoC architecture, implementation, analysis, optimization, and verification, encompassing various aspects of NoCs for embedded high-performance computing systems, un-core and system-level NoCs, inter/intrachip, and rack-scale networks. Similar to previous years, this event has been held in conjunction with the Embedded Systems Week (ESWEEK). This year, NOCS was held in Hamburg, Germany, on 21–22 September 2023, marking its return to a fully in-person conference after virtual and hybrid editions during the pandemic.
2023片上网络国际研讨会特刊
片上网络(NOCS)国际研讨会是研究片上网络架构、实现、分析、优化和验证的主要跨学科会议,涵盖了嵌入式高性能计算系统、非核和系统级网络、芯片间/芯片内网络和机架规模网络的NOCS的各个方面。与往年类似,本次活动与嵌入式系统周(ESWEEK)同时举行。今年,NOCS于2023年9月21日至22日在德国汉堡举行,标志着继大流行期间的虚拟会议和混合会议之后,它又回到了完全面对面的会议。
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来源期刊
IEEE Design & Test
IEEE Design & Test COMPUTER SCIENCE, HARDWARE & ARCHITECTURE-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
3.80
自引率
5.00%
发文量
98
期刊介绍: IEEE Design & Test offers original works describing the models, methods, and tools used to design and test microelectronic systems from devices and circuits to complete systems-on-chip and embedded software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. The magazine seeks to bring to its readers not only important technology advances but also technology leaders, their perspectives through its columns, interviews, and roundtable discussions. Topics include semiconductor IC design, semiconductor intellectual property blocks, design, verification and test technology, design for manufacturing and yield, embedded software and systems, low-power and energy-efficient design, electronic design automation tools, practical technology, and standards.
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