Validation of Automotive Centrals Using Hardware in the Loop-Body Control Unit and Lights

Q4 Engineering
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引用次数: 0

Abstract

The race for electrification and the need for innovation to attract customers has led the automotive industry to do something different with vehicles. New emissions control challenges and efficient technological availability are the pillars of creation. The growing demand to upgrade industrial manufacturing systems creates actions that directly impact vehicle production. With this comes the search for new prototyping methods and virtual tools for component testing and validation, and vehicle systems have established themselves. The demand for Electronic Control Units (ECU) is increasing due to the availability of intelligence and safety in today's vehicles, directly affecting their development, performance, and functional testing. In order to keep up with global changes, the automotive industry uses different virtual environments to produce, verify and validate their vehicles and test prototypes used during development. Therefore, in this paper, integration and validation were performed using the Hardware in the Loop (HIL) test platform, focusing on the ECU Body Control Unit (BCM). Then, a brief commentary reviews other test medium platforms, such as the Plywood Buck (PWB), and examines the reliability, flexibility, installation time, and cost of the three test platforms, software in the loop (SIL), Model in the loop (MIL), and HIL, to review their benefits, challenges, and issues in use and information to optimize the use of each platform and test medium.
在环体控制单元和灯中使用硬件验证汽车中央
电气化的竞争以及吸引客户的创新需求促使汽车行业在汽车上做了一些不同的事情。新的排放控制挑战和有效的技术可用性是创新的支柱。不断增长的工业制造系统升级需求创造了直接影响汽车生产的行动。随之而来的是寻找用于组件测试和验证的新原型方法和虚拟工具,并且车辆系统已经建立了自己。由于当今车辆的智能化和安全性,对电子控制单元(ECU)的需求正在增加,这直接影响到它们的开发、性能和功能测试。为了跟上全球变化,汽车行业使用不同的虚拟环境来生产、验证和验证他们的车辆,并在开发过程中测试原型。因此,本文利用硬件在环(HIL)测试平台对ECU车身控制单元(BCM)进行了集成和验证。然后,简要回顾了其他测试介质平台,如胶合板Buck (PWB),并检查了三种测试平台的可靠性、灵活性、安装时间和成本,软件在环(SIL)、模型在环(MIL)和HIL,以回顾它们的优点、挑战和使用中的问题,并提供信息以优化每种平台和测试介质的使用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of Electrical and Electronics Engineering
Journal of Electrical and Electronics Engineering Engineering-Electrical and Electronic Engineering
CiteScore
0.90
自引率
0.00%
发文量
0
审稿时长
16 weeks
期刊介绍: Journal of Electrical and Electronics Engineering is a scientific interdisciplinary, application-oriented publication that offer to the researchers and to the PhD students the possibility to disseminate their novel and original scientific and research contributions in the field of electrical and electronics engineering. The articles are reviewed by professionals and the selection of the papers is based only on the quality of their content and following the next criteria: the papers presents the research results of the authors, the papers / the content of the papers have not been submitted or published elsewhere, the paper must be written in English, as well as the fact that the papers should include in the reference list papers already published in recent years in the Journal of Electrical and Electronics Engineering that present similar research results. The topics and instructions for authors of this journal can be found to the appropiate sections.
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