An Approximate Parallel Annealing Ising Machine for Solving Traveling Salesman Problems

IF 1.7 4区 计算机科学 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Qichao Tao;Tingting Zhang;Jie Han
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引用次数: 1

Abstract

Annealing-based Ising machines have emerged as high-performance solvers for combinatorial optimization problems (COPs). As a typical COP with constraints imposed on the solution, traveling salesman problems (TSPs) are difficult to solve using conventional methods. To address this challenge, we design an approximate parallel annealing Ising machine (APAIM) based on an improved parallel annealing algorithm. In this design, adders are reused in the local field accumulator units (LAUs) with half-precision floating-point representation of the coefficients in the Ising model. The momentum scaling factor is approximated by a linear, incremental function to save hardware. To improve the solution quality, a buffer-based energy calculation unit selects the best solution among the found candidate results in multiple iterations. Finally, approximate adders are applied in the design for improving the speed of accumulation in the LAUs. The design and synthesis of a 64-spin APAIM show the potential of this methodology in efficiently solving complicated constrained COPs.
求解旅行商问题的近似并行退火伊辛机
基于退火的伊辛机器已经成为组合优化问题(cop)的高性能求解器。旅行商问题(tsp)是一类典型的求解约束问题,难以用常规方法求解。为了解决这一挑战,我们设计了一种基于改进并行退火算法的近似并行退火伊辛机(APAIM)。在这个设计中,加法器在局部字段累加器单元(lau)中被重用,在Ising模型中使用半精度浮点表示系数。动量比例因子由一个线性的增量函数近似,以节省硬件。为了提高解的质量,基于缓冲的能量计算单元在多次迭代中从发现的候选结果中选择最佳解。最后,在设计中采用近似加法器来提高lau的积累速度。64自旋APAIM的设计和合成显示了该方法在有效求解复杂约束cop方面的潜力。
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来源期刊
IEEE Embedded Systems Letters
IEEE Embedded Systems Letters Engineering-Control and Systems Engineering
CiteScore
3.30
自引率
0.00%
发文量
65
期刊介绍: The IEEE Embedded Systems Letters (ESL), provides a forum for rapid dissemination of latest technical advances in embedded systems and related areas in embedded software. The emphasis is on models, methods, and tools that ensure secure, correct, efficient and robust design of embedded systems and their applications.
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