Thermal conductivity enhancement of aluminum scandium nitride grown by molecular beam epitaxy

IF 8.6 1区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Research Letters Pub Date : 2023-11-14 DOI:10.1080/21663831.2023.2279667

Gustavo A. Alvarez, Joseph Casamento, Len van Deurzen, Md Irfan Khan, Kamruzzaman Khan, Eugene Jeong, Elaheh Ahmadi, Huili Grace Xing, Debdeep Jena, Zhiting Tian

引用次数: 0

Abstract

Aluminum scandium nitride (AlScN) has been receiving increasing interest for radio frequency microelectromechanical systems because of their higher achievable bandwidths owing to the larger piezoelectric response of AlScN compared to AlN. However, alloying scandium (Sc) with aluminum nitride (AlN) significantly lowers the thermal conductivity of AlScN due to phonon alloy scattering. Self-heating in AlScN devices potentially limits power handling, constrains the maximum transmission rate, and ultimately leads to thermal failure. We grew plasma-assisted molecular beam epitaxy (PAMBE) AlScN on AlN-Al2O3 and GaN-Al2O3 substrates, and compared the cross-plane thermal conductivity to current work on AlScN grown on Si substrates.

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分子束外延生长氮化铝钪的热导率增强

氮化铝钪(AlScN)越来越受到射频微机电系统的关注，因为与AlN相比，AlScN具有更大的压电响应，从而具有更高的可实现带宽。然而，将钪(Sc)与氮化铝(AlN)合金化后，由于声子合金的散射，AlScN的导热系数显著降低。AlScN器件中的自加热可能会限制功率处理，限制最大传输速率，并最终导致热故障。我们在AlN-Al2O3和GaN-Al2O3衬底上生长了等离子体辅助分子束外延(PAMBE) AlScN，并将其与目前在Si衬底上生长的AlScN的平面导热性进行了比较。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Materials Research Letters Materials Science-General Materials Science

CiteScore

12.10

自引率

3.60%

发文量

审稿时长

3.3 months

期刊介绍： Materials Research Letters is a high impact, open access journal that focuses on the engineering and technology of materials, materials physics and chemistry, and novel and emergent materials. It supports the materials research community by publishing original and compelling research work. The journal provides fast communications on cutting-edge materials research findings, with a primary focus on advanced metallic materials and physical metallurgy. It also considers other materials such as intermetallics, ceramics, and nanocomposites. Materials Research Letters publishes papers with significant breakthroughs in materials science, including research on unprecedented mechanical and functional properties, mechanisms for processing and formation of novel microstructures (including nanostructures, heterostructures, and hierarchical structures), and the mechanisms, physics, and chemistry responsible for the observed mechanical and functional behaviors of advanced materials. The journal accepts original research articles, original letters, perspective pieces presenting provocative and visionary opinions and views, and brief overviews of critical issues.