Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic- Electro-Thermal Behavior of Power Conversion System During Load Operation” [ASME J. Electron. Packag., 2023, 145(2), p. 021005; DOI: 10.1115/1.4055591]

IF 2.2 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Electronic Packaging Pub Date : 2023-10-05 DOI:10.1115/1.4063546

Erica Hodge

引用次数: 0

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出版人注:“负荷运行时电力转换系统电磁-电热行为评估的动态建模框架”[ASME J. Electron]。Packag。生物医学工程学报，2009,45(2)，p. 021005;DOI: 10.1115/1.4055591)

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Electronic Packaging 工程技术-工程：电子与电气

CiteScore

4.90

自引率

6.20%

发文量

审稿时长

3 months

期刊介绍： The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.