A Physics based MTJ Compact Model for State-of-the-Art and Emerging STT-MRAM Failure Analysis and Yield Enhancement

Nishtha S. Gaul, A. Jaiswal, H. Yoon, T. Lee, K. Yamane, J. Versaggi, R. Carter, B. Paul
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引用次数: 1

Abstract

In this paper, a physics based compact model for STT - MRAM is presented which is capable of fast circuit simulation and design space exploration, while enabling the intrinsic device characterization, like transient behavior, effect of thermal noise and Monte-Carlo simulations. The proposed model does not use any technology specific fitting parameters and hence, is fully technology agnostic and scalable. A two-step coupled simulation methodology was developed to account for both the process and initial angle variations, simultaneously. The model has been extensively validated with 22nm FDSOI MRAM hardware data across different PVT corners with less than 4% RMS error. The scalability of the model has further been demonstrated on a state-of-the-art high performance (high speed switching) MTJ stack.
基于物理的MTJ紧凑模型,用于最先进和新兴的STT-MRAM失效分析和良率提高
本文提出了一种基于物理的STT - MRAM紧凑模型,该模型能够实现快速电路仿真和设计空间探索,同时能够实现器件的固有特性,如瞬态行为、热噪声效应和蒙特卡罗模拟。所提出的模型不使用任何技术特定的拟合参数,因此,是完全技术不可知和可扩展的。一种两步耦合仿真方法被开发来同时考虑过程和初始角度的变化。该模型已在不同PVT角上使用22nm FDSOI MRAM硬件数据进行了广泛验证,均方根误差小于4%。该模型的可扩展性已在最先进的高性能(高速交换)MTJ堆栈上得到进一步验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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