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Radical etching of high-k and low-k dielectrics for three-dimension device manufacturing with microwave-ECR etching system

Advanced Etch Technology and Process Integration for Nanopatterning XII Pub Date : 2023-04-30 DOI:10.1117/12.2656040
Yusuke Nakatani, Yasushi Sonoda, T. Iwase, Yi‐Ying Lin, Masashi Kawabata, Motohiro Tanaka
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微波- ecr蚀刻系统用于三维器件制造的高k和低k介质自由基蚀刻
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Advanced Etch Technology and Process Integration for Nanopatterning XII
Advanced Etch Technology and Process Integration for Nanopatterning XII
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