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Session III Panel Discussions: The Future of Mission-critical, Mixed-criticality High-performance Embedded Systems

2022 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS) Pub Date : 2022-04-20 DOI:10.1109/coolchips54332.2022.9772707
{"title":"Session III Panel Discussions: The Future of Mission-critical, Mixed-criticality High-performance Embedded Systems","authors":"","doi":"10.1109/coolchips54332.2022.9772707","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":266152,"journal":{"name":"2022 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)","volume":"12 3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-04-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/coolchips54332.2022.9772707","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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第三部分小组讨论:关键任务、混合关键高性能嵌入式系统的未来
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2022 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)
2022 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)
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