On the modelling of interconnection discontinuities

Abstract

An efficient and simple method of modelling of printed-circuit board (PCB) discontinuities is presented. Based on time-domain measurements and subsequent microwave analysis the method enables the PCB discontinuity S-parameters to be calculated. Then, as black box, they can be incorporated into a circuit simulator in order to carry out the transient analysis of overall digital module. The modelling results of DIN-connector are compared to experimental data and good agreement is reported.