High-Density 300-Gbps/cm2 Parallel Free-Space Optical Interconnection Design Considerations

Abstract

A high-density, high-throughput 300-Gbps/cm2 parallel free-space optical interconnection has been designed and demonstrated. The impact of component technology choices and optical, electrical, and mechanical issues will be discussed within the context of this prototype system with implications for future systems. Many of the design considerations for this prototype are common to other optical interconnection and processing systems based on arrays of components. The prototype, a linear array parallel free-space optical interconnection with up to twenty optical data paths, operated at a rate of up to 2.8 Gbps per optical data path with a delay or latency of 200 ps.