Dielectric analysis of the cure of thermosetting epoxy/amine systems

Abstract

The use of dielectric measurements to monitor the cure of thermosetting polymers dates back to the pioneering work of Kienle and Race in 1934 [1]; a review of the literature may be found in [2]. In 1966, Olyphant [3] recognized that the changes in the dielectric properties during cure are related to the change in the glass transition temperature that accompanies the curing reaction. A better understanding of this relationship would be of considerable value in the application of dielectric measurements to the processing of epoxies.