Phased Array Architecture Enabling Scalable Integrated Sensing and Communication

K. Kolodziej, G. Brigham, M. Harger, B. Janice, Adrienne I. Sands, R. Teal, Louis Turek, Pierre-Francois W. Wolfe, J. Doane, B. Perry
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Abstract

Phased array systems can straightforwardly support integrated sensing and communication (ISAC) as well as other functions simultaneously by incorporating in-band full-duplex (IBFD) technology. Digitally-controlled self-interference cancellation techniques have been shown to create isolation between transmit and receive sub arrays within a single aperture for limited numbers of elements. This paper discusses the key components of a scalable panel-based IBFD array system, including the aperture and backplane assemblies as well as a cold plate structure for thermal management. The array is designed to operate from 2.7 to 3.5 GHz, and will provide the opportunity to demonstrate ISAC capability in a fashion that is scalable for many different deployment locations and/or platforms.
相控阵架构支持可扩展的集成传感和通信
相控阵系统可以直接支持集成传感和通信(ISAC)以及其他功能同时结合带内全双工(IBFD)技术。数字控制的自干扰消除技术已被证明可以在单个孔径内为有限数量的元件创建发射和接收子阵列之间的隔离。本文讨论了基于可扩展面板的IBFD阵列系统的关键组件,包括孔径和背板组件以及用于热管理的冷板结构。该阵列的工作频率为2.7至3.5 GHz,将以可扩展的方式展示ISAC能力,适用于许多不同的部署位置和/或平台。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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