{"title":"Silicon photonic devices and their integration","authors":"K. Ohashi","doi":"10.1109/INOW.2008.4634437","DOIUrl":null,"url":null,"abstract":"Optical communication is accepted as practical when the cost of introducing it is less than that of the conventional electronics. Silicon photonics is the prime candidates for low-cost highly integrated photonic devices because silicon semiconductor industry gives the most cost-effective and highly-integrated devices today. In addition to that, silicon as an optical material offers high-index contrast waveguides and hence it gives micro-meter scale passive optical devices. Those advantages could lead silicon photonics as a key technology for shorter interconnects such as on-chip networks as well as for long-haul telecommunication devices. Low cost integration of photonics with LSI using 3D-integration and surface-plasmon devices will be discussed briefly.","PeriodicalId":112256,"journal":{"name":"2008 International Nano-Optoelectronics Workshop","volume":"84 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Nano-Optoelectronics Workshop","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/INOW.2008.4634437","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Optical communication is accepted as practical when the cost of introducing it is less than that of the conventional electronics. Silicon photonics is the prime candidates for low-cost highly integrated photonic devices because silicon semiconductor industry gives the most cost-effective and highly-integrated devices today. In addition to that, silicon as an optical material offers high-index contrast waveguides and hence it gives micro-meter scale passive optical devices. Those advantages could lead silicon photonics as a key technology for shorter interconnects such as on-chip networks as well as for long-haul telecommunication devices. Low cost integration of photonics with LSI using 3D-integration and surface-plasmon devices will be discussed briefly.