Towards high density STT-MRAM at sub-20nm nodes

V. Nguyen, N. Perrissin, S. Lequeux, J. Chatterjee, L. Tille, S. Auffret, R. Sousa, E. Gautier, L. Vila, L. Prejbeanu, B. Dieny
{"title":"Towards high density STT-MRAM at sub-20nm nodes","authors":"V. Nguyen, N. Perrissin, S. Lequeux, J. Chatterjee, L. Tille, S. Auffret, R. Sousa, E. Gautier, L. Vila, L. Prejbeanu, B. Dieny","doi":"10.1109/VLSI-TSA.2018.8403867","DOIUrl":null,"url":null,"abstract":"STT-MRAM are attracting an increasing interest from microelectronics industry. They are about to enter in volume production with the first goal of replacing embedded Flash memory. To go towards high density STT-MRAM at sub-20nm nodes, two major issues have to be solved. One is the nanopatterning of the magnetic tunnel junctions at 1x feature size (F) and narrow pitch (pitch<2F). The other is to increase the thermal stability of the storage magnetization at sub-20nm nodes. This paper addresses these two issues and propose innovative approaches to solve these two difficulties.","PeriodicalId":209993,"journal":{"name":"2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSI-TSA.2018.8403867","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

Abstract

STT-MRAM are attracting an increasing interest from microelectronics industry. They are about to enter in volume production with the first goal of replacing embedded Flash memory. To go towards high density STT-MRAM at sub-20nm nodes, two major issues have to be solved. One is the nanopatterning of the magnetic tunnel junctions at 1x feature size (F) and narrow pitch (pitch<2F). The other is to increase the thermal stability of the storage magnetization at sub-20nm nodes. This paper addresses these two issues and propose innovative approaches to solve these two difficulties.
迈向20nm以下节点的高密度STT-MRAM
STT-MRAM正吸引着微电子行业越来越多的兴趣。他们即将进入批量生产,第一个目标是取代嵌入式闪存。为了实现20nm以下节点的高密度STT-MRAM,必须解决两个主要问题。一是磁性隧道结在1倍特征尺寸(F)和窄节距(节距<2F)处的纳米图形化。二是提高存储磁化在亚20nm节点的热稳定性。本文探讨了这两个问题,并提出了解决这两个难题的创新途径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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