Technology trends and implications on SoC design

J. Burns
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引用次数: 2

Abstract

Semiconductor technology evolution is increasingly driven by disruptive innovations rather than classical 2D scaling. These innovations, and potential new technologies such as 3D integration, will allow device counts to continue to increase well beyond the 1 – 2 billion of today's chips. With this ongoing growth in available devices the challenges in design quality and productivity will also grow, along with the investments needed for technology development and manufacturing. The challenges for chip and system designs lie in finding affordable means to harness these capabilities to deliver significant system level value to end users. In this presentation I will explore several of these technology trends, in the context of SoC design for high-performance systems, and describe several of the initiatives underway in IBM Research to address them.
SoC设计的技术趋势和影响
半导体技术的发展越来越多地受到颠覆性创新的推动,而不是传统的二维缩放。这些创新,以及潜在的新技术,如3D集成,将使设备数量继续增长,远远超过今天的10 - 20亿芯片。随着可用设备的持续增长,设计质量和生产率方面的挑战也将增加,同时技术开发和制造所需的投资也将增加。芯片和系统设计的挑战在于找到经济实惠的方法来利用这些功能,为最终用户提供重要的系统级价值。在本次演讲中,我将在高性能系统SoC设计的背景下探讨这些技术趋势中的几个,并描述IBM研究院正在进行的几个旨在解决这些问题的计划。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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