Analysis of transient charging components in NBTI degradation studied for TaN gated HfO2/SiO2 dielectrics

K. Okada, T. Horikawa, H. Ota, T. Nabatame, A. Toriumi
{"title":"Analysis of transient charging components in NBTI degradation studied for TaN gated HfO2/SiO2 dielectrics","authors":"K. Okada, T. Horikawa, H. Ota, T. Nabatame, A. Toriumi","doi":"10.1109/ESSDERC.2007.4430897","DOIUrl":null,"url":null,"abstract":"Threshold voltage (V,h) shift under the NBT-stress of TaN gated HfO2/SiO2 stacked gate dielectrics has been studied by conventional DC and the pulsed measurements. A large Vth shift in the early stage of stress occurs typically within 1 s by the fast transient charging under the stress as well as during the Vth measurement. Contributions of both charging components strongly depend on the film quality and also on the stress conditions. Therefore, an accurate deconvolution of measured DeltaVth into each component is indispensable for accurate lifetime prediction and the understandings of the NBTI reliability.","PeriodicalId":103959,"journal":{"name":"ESSDERC 2007 - 37th European Solid State Device Research Conference","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ESSDERC 2007 - 37th European Solid State Device Research Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSDERC.2007.4430897","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Threshold voltage (V,h) shift under the NBT-stress of TaN gated HfO2/SiO2 stacked gate dielectrics has been studied by conventional DC and the pulsed measurements. A large Vth shift in the early stage of stress occurs typically within 1 s by the fast transient charging under the stress as well as during the Vth measurement. Contributions of both charging components strongly depend on the film quality and also on the stress conditions. Therefore, an accurate deconvolution of measured DeltaVth into each component is indispensable for accurate lifetime prediction and the understandings of the NBTI reliability.
TaN门控HfO2/SiO2介质中NBTI降解瞬态充电组分分析
采用常规直流和脉冲测量方法研究了TaN门控HfO2/SiO2堆叠栅介质在nbt应力作用下的阈值电压(V,h)漂移。在应力作用下的快速瞬态充注以及在Vth测量过程中,在应力早期通常在1s内发生较大的Vth位移。两种充电成分的贡献很大程度上取决于薄膜质量和应力条件。因此,对测量到的DeltaVth进行精确的反卷积,对于准确的寿命预测和对NBTI可靠性的理解是必不可少的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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