Low temperature characterization of 14nm FDSOI CMOS devices

M. Shin, M. Shi, M. Mouis, A. Cros, E. Josse, G. Kim, G. Ghibaudo
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引用次数: 47

Abstract

A detailed characterization of low temperature operation of n and p MOS devices from 14nm FDSOI CMOS technology has been conducted. The transfer characteristics measured between 77K and 300K exhibit very good performance for effective gate lengths down 15nm, emphasizing the very good control of short channel effects and subthreshold behavior. Moreover, the temperature dependence of the low field mobility clearly indicates that, for long devices, it is limited by phonon scatterings whereas, for sub 100nm gate lengths, the mobility is significantly degraded and almost independent with temperature. This feature is attributed to scattering by neutral defects, which are originated from source and drain process and extending over several tens of nm along the channel.
14nm FDSOI CMOS器件的低温特性
采用14nm FDSOI CMOS技术对n和p MOS器件的低温工作进行了详细表征。在77K和300K之间测量的转移特性在有效栅极长度下降15nm时表现出非常好的性能,强调了对短通道效应和亚阈值行为的非常好的控制。此外,低场迁移率的温度依赖性清楚地表明,对于长器件,它受到声子散射的限制,而对于低于100nm栅极长度的器件,迁移率明显下降,几乎与温度无关。这一特征归因于中性缺陷的散射,中性缺陷起源于源极和漏极过程,沿通道延伸了几十nm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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