A crosstalk avoidance method combining crosstalk avoidance code with shielding wire technique

Abstract

Through-silicon vias (TSVs) play an important role as the vertical connections in three dimensional (3D) integrated circuit (IC). However, the 3D IC suffers from the increasing crosstalk noise between TSVs as the working frequency gets higher. The crosstalk in TSV arrays is more complicated than that of 2D IC because more aggressors have to be considered. This paper proposes a crosstalk avoidance method combining the crosstalk avoidance code (CAC) with the shielding wire technique by dividing the TSV array into some 3×3 sub-arrays. This method can suppress the crosstalk in TSV array below 4.5C level, which elevates the performance of 3D IC effectively.