Low temperature fabrication of poly-Si FEA for display application

Technical Digest of the 17th International Vacuum Nanoelectronics Conference (IEEE Cat. No.04TH8737) Pub Date : 2004-07-11 DOI:10.1109/IVNC.2004.1354936

M. Nagao, Y. Sacho, S. Kanemaru, T. Matsukawa, J. Itoh

引用次数: 1

Abstract

A HfC-coated poly-Si field emitter array was fabricated to be suitable for display applications using glass substrates. Low temperature Ar ion sputtering improved the emission reliability by tip sharpening while the HfC coating solved the uniformity and emission lifetime problems.

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显示用多晶硅有限元分析的低温制备

制备了一种适用于玻璃基板显示应用的hfc涂层多晶硅场发射极阵列。低温氩离子溅射通过尖端锐化提高了发射可靠性，而HfC涂层则解决了均匀性和发射寿命问题。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Technical Digest of the 17th International Vacuum Nanoelectronics Conference (IEEE Cat. No.04TH8737)

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