Measuring Thermal Diffusivity of Thin Films in Thickness Direction

Shijie Chen, F. Zheng, Chenyu Huang, Yewen Zhang
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Abstract

Thin polymer films are widely used in electric and electronic industries, due to their outstanding electrical insulation properties. The accurate thermal parameters of thin film are beneficial to describe the thermal characteristics of electronic devices, which may improve their stability and service life. Therefore, it is important to measure the thermal parameters of thin films in high accuracy. We propose a novel method based on thermal response current to achieve the measurement of the thermal diffusivity of thin film with thickness several micrometers. In this paper, a two-layer sample structure is utilized, where one of the layers acts as the detector with known thermal parameters and the other as measured film. We record the thermal displacement current of the detector film and analyze the time-domain characteristics of the thermal displacement current. The temperature distribution in the two-layer structure and the displacement current by the thermal pulse exciting detector layer were simulated by numerical calculation, the optimal solution of the thermal diffusivity of the thin film is achieved through multiple iterations. This method can quickly measure the thermal diffusivity of thin film in thickness direction with high accuracy, especially suitable for polymer films with a thickness of a few microns.
薄膜厚度方向热扩散系数的测量
聚合物薄膜由于其优异的电绝缘性能而广泛应用于电气和电子工业。准确的薄膜热参数有利于描述电子器件的热特性,从而提高电子器件的稳定性和使用寿命。因此,薄膜热参数的高精度测量具有重要意义。提出了一种基于热响应电流的新方法来测量厚度为几微米的薄膜的热扩散系数。本文采用两层样品结构,其中一层作为已知热参数的探测器,另一层作为被测薄膜。记录了探测器薄膜的热位移电流,分析了热位移电流的时域特性。通过数值计算模拟了两层结构中的温度分布和热脉冲激发探测器层的位移电流,通过多次迭代得到了薄膜热扩散系数的最优解。该方法可以快速测量薄膜在厚度方向上的热扩散系数,精度高,特别适用于厚度为几微米的聚合物薄膜。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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