Comparison of solid state, MPM, and TWT based transmitters for spaceborne applications

M.C. Smith, L. Dunleavy
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引用次数: 13

Abstract

This study compares current and projected state-of-the-art microwave power amplifiers used in spaceborne transmitter technologies at frequencies through 100 GHz. Projected are future trends in power PHEMTs and in wide bandgap semiconductor devices such as GaN and SiC. Also, the more established InP HEMT low-noise devices are examined for possible power amp applications specifically in the millimeter wave region. Three key power amplifier technologies, including the traveling wave tube amplifier (TWTA), the solid state power amplifier (SSPA), and the microwave power module (MPM), have emerged in varying degrees as heritaged and/or viable components in spaceborne transmitters. Addressed as figures of merit are significant discriminators such as long term reliability, space heritage (failure-free on orbit performance), process/device maturity, size, weight, and efficiency.
基于空间应用的固态、MPM和行波管发射机的比较
这项研究比较了目前和计划中最先进的微波功率放大器在100 GHz频率范围内用于星载发射机技术。预测了功率phemt和宽带隙半导体器件(如GaN和SiC)的未来趋势。此外,还研究了更成熟的InP HEMT低噪声器件在毫米波区域的潜在功率放大器应用。行波管放大器(TWTA)、固态功率放大器(SSPA)和微波功率模块(MPM)等三种关键功率放大器技术作为传统和可行的星载发射机组件,已不同程度地出现。作为优点的数字是重要的判别因素,如长期可靠性、空间遗产(在轨无故障性能)、工艺/设备成熟度、尺寸、重量和效率。
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