DEVELOPMENT OF A METHOD FOR DETERMINATION OF THERMOPELASTIC STRESSES IN GAAS PLATES

A. Oksanich, M. Kogdas, V. Dragobetsky, V. Bakhmat
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Abstract

Purpose. А study of the temperature field of the melt during the cultivation of GaAs single crystals from under a layer of liquid flux. Thermoplastic stresses were measured on plates cut from the upper, middle and lower part of the ingot of undoped GaAs.Methodology. Finite element method is used to calculate temperature profiles and internal thermoplastic stresses. The mechanism of theoretical and experimental researches which allow to predict thermoplastic stresses in the course of cultivation of ingots is offered. For the analysis and mathematical calculations of the stationary differential equation in partial derivatives and the equations of thermoelasticity, respectively, use the finite element method, the calculations were performed in the programs THERMIX and INCA. Temperature profiles and internal thermoplastic stresses were calculated. Thermoplastic stresses were measured on plates cut from the upper, middle and lower part of the ingot of undoped GaAs (cm-3) with a thickness of 1 mm with a resistivity of 108 Ohm x cm, diameter 50 mm, orientation (111).The axial temperature gradient is determined. Experimentally obtained values of ison voltage lines along the plane of GaAs plates cut from different parts of the ingot. To measure the internal (thermoplastic) stresses in the work used the method of photoelastic-guests in infrared polarized light. The integrated picture of thermoplastic stresses was obtained using the "Polaron" installation, and the point measurement with the construction of the iso-voltage line was obtained on the "Polaron-2" installation. Originality. As a result of the research it can be concluded that the mechanism of theoretical and experimental researches is offered in the work, which allows to predict thermoplastic stresses in the process of growing GaAs ingots and, finally, to develop a procedure for reducing dislocation density in GaAs ingots. The practical value. the proposed method will improve the technology of growing ingots of gallium arsenide with a more homogeneous technology, which will be a good indicator for the future creation of gas sensors from this material.
气相板热弹性应力测定方法的发展
目的。А在液体通量层下培养GaAs单晶过程中熔体温度场的研究。对未掺杂gaas钢锭上、中、下切下的板材进行了热塑性应力测量。采用有限元法计算温度分布和内部热塑性应力。提出了预测钢锭成形过程中热塑性应力的理论和实验研究机制。分别在THERMIX和INCA程序中对偏导数方程和热弹性方程进行有限元分析和数学计算。计算了温度分布和内部热塑性应力。在厚度为1 mm的未掺杂GaAs (cm-3)铸锭上、中、下切下电阻率为108欧姆× cm、直径为50 mm、取向为111的板上测量热塑性应力。确定轴向温度梯度。实验得到了从铸锭不同部位切割的砷化镓板沿平面的电力线值。在红外偏振光下,采用光弹性-客体法测量工作中的内部(热塑性)应力。利用“极化子”装置获得了热塑性应力的整体图像,并在“极化子-2”装置上获得了等压线路的点测量。创意。研究结果为理论和实验研究提供了理论和实验研究的机制,从而可以预测GaAs铸锭生长过程中的热塑性应力,并最终制定了降低GaAs铸锭中位错密度的方法。实用价值。所提出的方法将以更均匀的技术改进砷化镓锭的生长技术,这将是未来用这种材料制造气体传感器的一个很好的指标。
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