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Investigation of Thermal Stability of High-kappa Interpoly Dielectrics in TaN Metal Floating Gate Memory Structures

2011 3rd IEEE International Memory Workshop (IMW) Pub Date : 2011-05-22 DOI:10.1109/IMW.2011.5873183
S. Jayanti, Xiangyu Yang, V. Misra
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引用次数: 3

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TaN金属浮栅记忆结构中高卡帕内插介质的热稳定性研究
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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2011 3rd IEEE International Memory Workshop (IMW)
2011 3rd IEEE International Memory Workshop (IMW)
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